Why Does PC Endurance Board Crack?

The internal stress of the PC endurance board is formed in the process of extrusion molding and cooling and shaping. When the PC endurance board is placed or used without any change in its shape, it will experience a stress relaxation effect, and some internal cleaning can be done. stress. However, it is difficult for loose PC endurance boards with limited experience to completely eliminate these stresses, and there are still stresses inside them. If you do not pay attention to increasing the external stress during use, local deformation of the surface layer will occur and be close to the surface. From here, it is now prone to breakage (small cracks and cracks). Therefore, we need to avoid incorrect or excessive external stress during use.
1. Do not damage or remove the protective film before the PC endurance board is installed to avoid scratching the surface.
2. It is never allowed to nail the board directly to the frame, otherwise high stress will be generated due to the expansion of the board and the perforated edges will be damaged.
3. Transportation and storage need to be properly padded, packaged, and laid flat, because any slight damage (such as scratches) to the surface of the board will develop into cracks. And boards should not be stored in the same location as other chemicals, as volatiles can cause chemical stress cracking on the surface of the board.
4. Regardless of the type of processing of PC endurance boards, the cutting tools or tools must not cause any damage to the non-processed parts of the board, and the cuts should be as smooth as possible. Minor damage can lead to severe cracking.
5. If the curvature rate of the bent plate is too small, the mechanical strength and chemical resistance of the plate will drop sharply. In order to avoid dangerous stress cracking on the exposed side, the bending radius of the PC endurance plate shall not be less than the thickness of the plate. 175 times.